Supply TUO oxygen-free copper plate conductivity, TUO oxygen-free copper plate price

Oxygen-free copper is pure copper that does not contain oxygen or any deoxidizer residue. But it actually still contains very trace amounts of oxygen and some impurities. According to the standard, the content of oxygen-free copper is not greater than .3, the total impurity content is not greater than .3, and the purity of copper is not greater than . According to the oxygen content and impurity content, oxygen-free copper is divided into No. 1 and No. 2 oxygen-free copper. The purity of No. 1 oxygen-free copper reaches .3, the oxygen content is not more than .3, and the total impurity content is not more than .3. The purity of No. 2 oxygen-free copper reaches ., the oxygen content is not more than .3, and the total impurity content is not more than .3.
Oxygen-free copper has no hydrogen embrittlement phenomenon, high electrical conductivity, good processing performance, welding performance, corrosion resistance and low temperature performance. The standards for oxygen content in different countries are not exactly the same, and there are certain differences. (oxygen-free copper): metallic copper with a purity of. Generally used in audio equipment, vacuum electronic devices, cables and other electrical and electronic oxygen-free copper applications. Among them, oxygen-free copper includes (linear crystallized oxygen-free copper or crystalline oxygen-free copper): the purity is above . and (single crystal oxygen-free copper): the purity is the highest, above . The single crystal oxygen-free copper made with - technology has no directionality, high purity, anti-corrosion, and extremely low electrical impedance, making the wire suitable for high-speed and high-quality signal transmission.
Oxygen copper rods and oxygen-free copper rods
Oxygen copper rods and oxygen-free copper rods are different due to different manufacturing methods and have their own characteristics.
) Regarding the inhalation and removal of oxygen and its existence state, the oxygen content of cathode copper in the production of copper rods is generally about 100%. The solid solubility of oxygen in copper at normal temperature is about 10%. The oxygen content of low-oxygen copper rods is generally between 1 and 2, so the entry of oxygen is inhaled in the liquid state of copper. On the contrary, the oxygen-free copper rods of the upward-drawing method are reduced and removed after the oxygen is kept under liquid copper for a considerable period of time. , Usually the oxygen content of such rods is below, and the lowest can reach -. From a organizational point of view, the oxygen in low-oxygen copper exists near the grain boundaries in the form of copper oxide, which is very important for low-oxygen copper rods. It can be said to be common but rare for oxygen-free copper rods. The presence of copper oxide in the form of inclusions at grain boundaries has a negative impact on the toughness of the material. The oxygen in oxygen-free copper is very low, so the structure of this copper is a uniform single-phase structure, which is beneficial to toughness. Porosity is uncommon in oxygen-free copper rods and is a common defect in low-oxygen copper rods.
) The difference between hot-rolled structure and cast structure. Since the low-oxygen copper rod has been hot-rolled, its structure is a hot-processed structure. The original casting structure has been broken, and recrystallization has appeared in the rod. Oxygen-free copper rods have a cast structure with coarse grains. This is the inherent reason why oxygen-free copper has a higher recrystallization temperature and requires a higher annealing temperature. This is because recrystallization occurs near the grain boundaries. The oxygen-free copper rod structure has coarse grains, and the grain size can even reach several millimeters. Therefore, there are few grain boundaries. Even if it is deformed by drawing, the grain boundaries are relatively low. There are still fewer oxygen copper rods, so higher annealing power is required. The requirements for successful annealing of oxygen-free copper are: the first annealing when the wire is drawn from the rod but has not yet been cast, the annealing power should be higher than that of low-oxygen copper in the same situation. After continuous drawing, sufficient margin should be left for the annealing power in subsequent stages and different annealing processes should be performed on low-oxygen copper and oxygen-free copper to ensure the softness of the in-process and finished wires.