- 测量范围:
- 0.02-500UM
- 误差:
- 1%
- 最小读数:
- 0.001
Oxford Instruments thickness measurement instruments are designed to meet the copper thickness measurement and quality control needs of the printed circuit board industry.
Can be used to measure surface copper and copper thickness within through holes. This highly scalable benchtop thickness gauge system can use both microresistance and eddy current methods to achieve accurate and precise measurements of surface copper and through-hole copper thickness. The benchtop measurement system has very high versatility and scalability, and its compatibility with a variety of probes enables it to meet a variety of application needs, including measurement of copper thickness in surface copper through-holes and micro-holes, as well as in-hole copper quality testing. .
It also has advanced statistical functions for sorting and analyzing test data.
>Technical Parameters
>Technical parameters for R-face copper probe testing:
Copper thickness measurement range:
Chemical copper: ( )
Electroplated copper: ( )
Linear copper testable line width range: ( )
Accuracy % ( ) Reference standard piece
Accuracy: Chemical Copper: Standard Deviation % Electroplated Copper: Standard Deviation %
Resolution: , ,
, ,
Technical parameters for hole copper probe testing:
Minimum testable hole diameter: ( )
Measurement thickness range: ( )
Principle of eddy current: comply with the relevant provisions of the standard
Accuracy: ( ) ( )
Accuracy: (), up to % (under laboratory conditions)
Resolution: ()
R
(Microhole) probe testing technical parameters:
Minimum testable hole diameter range : ( )
Testing range of copper thickness in hole: ()
Maximum testable board thickness: ()
Minimum testable board thickness: The minimum value of the board thickness must be higher than the minimum hole diameter value of the corresponding test circuit board ()
Accuracy (compared to metallographic detection method): ( ) ( )
%( ) < br />
Accuracy: It is not recommended to test the same hole multiple times
Resolution: ( )
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