Double layer polyimide tape laminate polyimide tape

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Double-layer polyimide tape laminated to polyimide tape
Polyimide tape laminated to fluoroplastic release film, polyimide laminating base material: polyimide film .
Thickness: .
Color: Brown golden yellow
Long-term temperature resistance: (℃)
Scope of application: With extremely low release force, suitable for C after shearing It can be used as a timely fit for mobile phones and various electronic and electrical appliances, and is suitable for die-cutting, circuit board printing and other industries.
Features: Polyimide tape combined with fluorine release film: has good temperature resistance, electrical insulation, chemical resistance, and is non-toxic and harmless to the human body and the environment. Use of polyimide tape lamination + fluorine plastic release film: Polyimide tape lamination with fluorine plastic release film has extremely low release force and is suitable for C mobile phones and various electronic and electrical appliances after cutting. It can be applied immediately and can be made into various labels. It is very convenient to use. It is a new type of silicone pressure-sensitive tape developed in recent years.
Polyimide tape + fluorine plastic release film.
Advantages: The product has excellent electrical properties, high insulation, high temperature resistance, low temperature resistance, acid and alkali resistance, low electrolysis, good mechanical properties, friction resistance, tear resistance, special adhesive treatment, strong adhesion, tear resistance There will be no residual glue left on the masked surface after removal.
Usage: , widely used in industrial sectors and insulation repair of motor cables, insulation of various electronic parts, high temperature insulation bundling of transformer coils, capacitor insulation materials, printed circuit boards (CB), electronic parts, resistance and capacitor production When fixing and passing the CB board through the tin furnace and wave soldering, it shields the gold finger part and prevents the immersion and contamination of the plating solution. There is no residual glue on the gold finger surface after peeling off the tape for gold plating shielding and protection of the printed circuit board.