Copper plating equipment, copper plating production line, copper plating tank, copper plating machinery and equipment factory

Text The copper electroplating production line is evenly colored, stable, never fades, has good metallic gloss and is durable. The main features of the equipment are high reliability. Resistance to harsh voltage environments, harsh and humid environments, reasonable wiring, complete protection functions, input AC undervoltage, overvoltage and phase loss protection, output overcurrent and overheating protection, as well as good heat dissipation and high-quality components ensure long-term reliable operation of the power supply. Small size and light weight. High efficiency, high precision, high stability, low ripple.
During the electroless copper plating process, the + ions gain electrons and are reduced to metallic copper. The reducing agent releases electrons and is oxidized itself. The essence of the reaction is the same as the electrolysis process, except that the process of gaining and losing electrons is carried out in a short-circuit state, and the flow of current cannot be seen externally. Therefore, electroless plating is a very energy-saving and efficient electrolysis process, because it does not have an external power supply and there is no resistance voltage drop and loss during electrolysis. A simple example can prove that during electroless copper plating, the printed boards can be arranged at intervals and immersed in the electroless copper plating solution for copper plating at one time, which is not possible with electroplating. Electroless copper plating can be deposited on any non-conductive substrate. This feature has been widely used in printed board manufacturing. The most widely used method is hole metallization to complete the interconnection of conductors between layers of double-sided or multi-layer printed boards. In addition, printed circuit boards are manufactured using the additive method of once-thick copper deposition.
Electroplating is the longest and most used wet deposition metal coating process in history. It refers to the process of depositing a thin layer of metal or alloy on a solid surface through electrochemical methods. When electroplating, connect the part to be plated to the negative pole of the DC power supply. The metal plates are connected to the positive terminal of a DC power supply, and they are then placed in a plating bath. The plating tank contains a solution of metal ions to be plated. When the DC power supply is turned on, current flows through, and the metal to be plated is deposited on the cathode.
Principle of electroplating Simply put, electroplating refers to the process of depositing a metal or alloy layer on the surface of a conductor such as metal by performing an electrolysis reaction in a solution with the help of external direct current. For example, copper plating can be used as an electrolyte solution. The metal to be plated is connected to the negative electrode of the power supply, and the positive electrode of the power supply is connected to pure copper. After power is applied, the cathode reacts and the metallic copper enters the plating solution in an ionic state and continuously migrates to the cathode. Finally, it is obtained on the cathode. The electrons are reduced to metallic copper, gradually forming a metallic copper coating
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