- 型号:
- HY-210
Product use: Potting of electronic display screens and circuit boards
Product description:
1. Product characteristics and Application
It is a low-viscosity, two-component room-temperature vulcanizing electronic potting adhesive that can be rapidly cured at room temperature and in depth. It can be applied to the surface of (-),, B, and other materials and metals, and has excellent bonding performance. Suitable for insulation, waterproofing and fixing of electronic accessories. Fully compliant with EU R directive requirements.
2. Typical uses of electronic potting glue
Potting protection for general electrical modules
Outdoor potting protection for display screens
3. Usage process:
Before mixing, first Stir the components thoroughly to evenly mix the settled black pigment, and shake Part B thoroughly.
.When mixing, the weight ratio of component: component B: should be observed.
3. Degassing can be performed as needed during use. You can stir the B mixture evenly and put it into a vacuum container, degas it for 3 minutes, and then pour it for use.
It is a room temperature curing product. After pouring, it is placed at room temperature to solidify. After basic solidification, it enters the next process. It takes several hours to fully solidify. Ambient temperature and humidity have a great impact on curing.