DMYP12A-4 single-sided pressure grinding machine

磨盘直径：

Φ1200mm

加工范围：

Φ440mm*4

球面范围：

≥R700mm

< - Single-sided pressure grinding and polishing machine
Mainly used for flat single-sided pressure grinding and polishing of silicon wafers, lithium niobate, glass, valves, mechanical seals and super-hard materials.
= d: . d -r KaiTi_ dMain technical parameters:
KaiTi_ d
-d
d
d
d
d
:
KaiTi_
-d -d. d grinding disc diameter
d
-d. . . - d
= -d. . . - d
-d. . . - d Spherical range

-d. . . - d
-d -d. d Processing range

-d. . d
<
-d. . d The number of revolutions of the grinding disc

-d. . d ~< revolutions< /min
(according to customer requirements)
(>r )
-d -d. d Maximum pressure
.r
-d. . d
-d. . d Total machine power

-d. . d
/
-d -d. d Machine tool weight

-d. . d is about<
-d. . d Overall dimensions

-d. . d
<
-d. d Kaili_ d Any special needs of the machine tool can be designed and manufactured according to the user's requirements.
KaiTi_ d
dddd