- CAS号:
- 931-36-2
- 分子式:
- C6H10N2
- 分子量:
- 110.16
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Used as epoxy resin curing agent, can be widely used in epoxy resin bonding, coating, Pouring, encapsulation, impregnation and composite materials, etc.
Ethylmethylimidazole has extremely good compatibility with epoxy resin, please refer to the dosage. Epoxy compound trial period. Curing reference conditions are degrees + degrees or degrees + degrees. Deformation temperature of cured material. The thermal oxidation resistance, chemical resistance, and especially acid resistance of cured epoxy resin are better than m-phenylenediamine curing agent. As the amount of curing agent increases and the curing temperature increases, the deformation resistance temperature increases.
Properties: light yellow thick liquid.
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Ethylmethylimidazole packaging price is RMB