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Internet of Things Experiment Box Type II

价格 10.00元/台
total supply
1000 台
MOQ
1 台
brand
深圳海天雄
area
SichuanChengdu City
Delivery period:
Shipped within 10 days from the date of payment by the buyer
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area:Sichuan Chengdu City

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Shenzhen Haitianxiong Electronics Co

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Product Details
核心:
Cortex-A9
CPU:
Samsung Exynos4412
规格:
430x300x125
< r/ Internet of Things/>
< ) < )<

< )< Hailian Internet of Things Technology Comprehensive Experiment System advocates the concept of product-based learning. The design of the system is based on mature Internet of Things product solutions and the introduction of actual product technologies. In this experimental system, students can fully master the cutting-edge technology of the Internet of Things through the study of the global system of point blocks, thereby achieving the perfect combination of learning knowledge points and product knowledge points.


< )< Hardware technical specifications
< )<

< )< System hardware consists of gateway network layer and perception layer hardware, including personal r Internet of Things gateway b coordinator B
< )< router sensor B controller R radio frequency module communication module wireless module Bluetooth module
< )< composed of modules and emulators
< )<

< )<(1) IoT gateway technical specifications
< )<

< )< Gateway processor: Application Processor, R r core, quad-core processor, main frequency~
< )<

< )< Memory chip built-in BRR, bit data bus
< )<

< )< Programmable: onboard B
< )<

< )< Display with driver motherboard: multi-point capacitive LCD display, resolution *
< )<

< )< adopts a built-in high-performance graphics processor, supports / graphics acceleration, and supports encoding and decoding functions of
< )< and other formats
< )<

< )< Human-computer interaction: touchable LCD screen, capable of real-time viewing of local data, mouse and keyboard can be connected through the B interface
< )<

< )< Onboard interface: RR serial port B interface HD digital video output interface digital
< )< Audio output interface/digital audio interface standard interface Ethernet interface Interface
< )< Interface interface r Camera interface Multiple user function buttons, onboard R real-time clock backup
< )< Backup battery, onboard R
< )<

< )< Onboard detachable sensors: electronic compass sensor for tablets and mobile phones, acceleration sensor, gyroscope sensor
< )<

< )< Supports serial port and The wireless coordinator communicates, receives data information from each sensor node, performs data analysis, processing and display
< )<

< )<

< )< (two ) Network layer technical parameters:
< )<

< )< B main control module
< )<

< )< This main control module The main chip used is the company's B second-generation high-end chip. This module is a true system-on-chip solution for B and R applications. It has the following characteristics:
< )<

< )< The module combines the excellent performance of the leading R transceiver with industry-standard enhanced BR flash memory
< )<

< )< The module has different low-power operation modes, making it especially suitable for systems with ultra-low power consumption requirements, and the mode switching time is extremely short
< )<

< )< High sensitivity and long transmission distance: This module uses an onboard B antenna, with an average gain above B. After actual outdoor testing, the communication distance in the open field
< )< is reachable, completely reaching the external The communication distance of the antenna is good
< )<

< )< Working frequency band
< )<

< )< Working voltage
< )<

< )< Operating temperature: ℃~℃ (nominal temperature ℃
< )<

< )< Storage temperature: ℃~℃ (Nominal temperature ℃
< )<

< )< Relative humidity: less than %R (Nominal humidity %R
< )<

< )< The module leads out all pins to facilitate function expansion and secondary use. The connection method is two rows of pin connections (*, spacing
< )<

< )< Size
< )<

< )< This module is used in conjunction with the coordinator, router and terminal chassis produced by our company to form the B network.
< )<

< )<

< )< BCoordinator Node Backplane
< )<

< )< The B main control module and the B coordinator node backplane form the B coordinator node, which sends or receives routing node or terminal node data through instructions sent by the host, and sends the received data to the host. The functional features of this backplane are:
< )<

< )< Main control module interface: spacing pin (row, each row of pins) socket interface, connected to the B main control module< br/> < )<

< )< Host communication: serial port communication with the host through the serial port level conversion chip
< )<

< )< and Communication with other nodes: realized through the R function of the connected main control board
< )<

< )< Power supply mode: B DC or single-cell lithium battery can be used
< )<

< )< B main control module: main control module power supply circuit,
< )<

< )< charging circuit: lithium battery charging circuit
< )<

< )< Functional interface: b interface, compatible with standard simulation tools
< )<

< )< Functional buttons: one reset, one normal Buttons
< )<

< )< Indicator lights: power indicator light, charging indicator light and networking indicator light
< )<

< ) < Operating temperature: ~ ℃ (nominal temperature ℃
< )<

< )< Storage temperature: ~ ℃ (nominal temperature ℃
< )<

< )< Relative humidity: less than %R (nominal humidity %R
< )<

< )< Size:.
< )<
< )<

< )< BRouter node backplane
< )<

< )< BMaster The module and the B router node base plate constitute the B routing node. When the coordinator node cannot communicate with all terminal nodes, the routing node serves as an intermediary to enable the coordinator node to communicate with the terminal nodes to realize the routing communication function. The functional features of this backplane are:
< )<

< )< Main control module interface: spacing pin (row, each row of pins) socket interface, connected to the B main control module< br/> < )<

< )< Communication with the coordinator or terminal or routing node: realized through the connected main control board R function
< )<

< )< Power supply method: B DC or single-cell lithium battery can be used
< )<

< )< B main control module: main control module power supply circuit,
< )<

< )< Charging circuit: lithium battery charging circuit
< )<

< )< Functional interface: b interface, compatible with standard simulation tools
< )<

< )< Function buttons: reset, normal buttons
< )<

< )< Indicator light: power indicator light charging indicator Lights and networking indicators
< )<

< )< Operating temperature: ~℃ (nominal temperature ℃
< )<

< )< Storage temperature: ~℃ (nominal temperature ℃
< )<

< )< Relative humidity: less than %R (nominal humidity %R
< )<< br />
< )< Size:.
< )<
< )<

< )< BTerminal equipment node backplane:
< )<

< )< B The main control module, the B terminal equipment node base plate and the sensor module control node module R module form the B terminal node to complete the control of the equipment and data collection, including the sensor module control node module R module and other data. The functional features of this backplane are:
< )<

< )< Main control module interface: spacing pin (row, each row of pins) socket interface, connected to the B main control module< br/> < )<

< )< Sensor module control node module R module and other interfaces: spacing pin (row, each row of pins) socket interface, and sensor module control
< )< The control node module R module is connected to lead out all ports
< )<

< )< Communication with the coordinator or routing node: realized through the connected main control board R function
< )<

< )< Power supply method: B DC or single-cell lithium battery can be used
< )<

< )< B main control module: Main control module power supply circuit,
< )<

< )< Charging circuit: lithium battery charging circuit
< )<

< )< Functional interface :b interface, compatible with standard simulation tools
< )<

< )< Function buttons: 1 reset, 2 normal buttons
< )<

< )< Indicator lights: power indicator light, charging indicator light and networking indicator light
< )<

< )< Operating temperature: ~℃ (nominal temperature ℃
< )<

< )< Storage temperature: ~℃ (nominal temperature ℃
< )<

< )< Relative humidity: less than %R (nominal Humidity %R
< )<

< )< Size:.
< )<

< )<

< )< (3) Perceptual layer technical parameters:
< )<

< )< The perception layer consists of sensor modules, controller modules and high-frequency R radio frequency card reading modules with different functions. The sensor module includes: temperature and humidity sensor, human body infrared induction sensor, light/light intensity sensor, infrared temperature measurement sensor, vibration detection sensor, air pressure measurement sensor, raindrop detection sensor, ultrasonic ranging sensor, magnetic field sensor, infrared beam sensor, sound detection sensor, smoke sensor, alcohol sensor, ultraviolet sensor, high precision Axis inertial navigation module. The controller module is composed of a full-color relay control module and a buzzer light, sound and light alarm module.
< )<

< )<

< )< (4) Wireless Radio Frequency R Kit (High Frequency):
< )<

< )< The R master control uses the company's R enhanced microcontroller
< )<

< )< The highest clock frequency can reach
< )<< br />
< )< The chip is equipped with B's program memory R and B's data memory
< )<

< )< The RF read-write chip adopts the company's high integration level R, its transmission rate can be as high as
< )<

< )< Support B multi-standard radio frequency protocol
< )<

< )< The maximum non-contact distance can reach
< )<

< )< It is configured with a dot matrix display with 10 characters, which can display the corresponding data operations
< )<< br />
< )< The R system communicates data with the host computer gateway through the serial port.
< )<

< )< Note: Low frequency UHF and development kit are optional.
< )<

< )<

< )<

< )< Software Technical Specifications
< )<

< )<(1) Gateway part
< )<

< )< r B operating system, kernel, b Br, R and file system format, All
< )< hardware peripheral interface drivers
< )<

< )< developed based on r system, based on the latest r
< ) <

< )< Provides rich application examples based on design language
< )<

< )< Contains wireless sensor networking software under the Internet of Things
< )<

< )< Provides typical Bluetooth and other wireless network example programs
< )<

< )< Provides software development environment< br/> < )<

< )< Supports the reception of wireless sensor data packets
< )<

< )< Supports the development of Internet mobile devices
/> < )<

< )< Support the research and development of IoT terminal equipment
< )<

< )< Support the secondary development of software, Technological innovation
< )<

< )< Provide IoT smart home examples
< )<

< )< Provide IoT security remote monitoring System examples
< )<

< )< Provide Internet of Things environmental monitoring system examples
< )<
< )<

< )<(2) Part B
< )<

< )< B specification, supports star network, tree network, supports multi-tasking
< )<

< )< Provides an engineering simulation and debugging environment based on the R integrated development environment
< )<

< )< Provides a wealth of application examples
< )<< br />
< )< Provide source program for microcontroller
< )<

< )< Support microcontroller analog-to-digital conversion program
< )<

< )< Provides sensor data collection/processing program source program under microcontroller
< )<

< )< Provides BR radio frequency wireless data communication examples
< ) <

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