d bd 'r H', H,
d bd 'r H', H, d bdFunction and Features
< d bd 'r H', H, > < rh d bd Surface mount to optimize panel space < d bd Small footprint package < d bd Typical failure mode is short circuit due to exceeding specified voltage or current < d bd Tin wire test is based on D's sum table. < d bd (r), (contact discharge). < d bd Data Line Protection Compliant< d bd Data Line Protection Compliant< d bd Built-in Stress Relief< d bd Typical Maximum Temperature Coefficient&DBR =% BR@ < d bd Passivated Glass Chip Contact< d Peak Pulse Power at bd Waveform is, repetition frequency (duty cycle): % < d bd Fast response time from volts to