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Panasonic chip placement machine product specifications: Yang Sheng
Equipped with the latest functions of high-quality placement Panasonic chip placement machine
Equipped with the latest functions corresponding to components
Expand The range of components supported by conventional high-speed placement heads.
The newly developed universal mounting head (nozzle) can mount large components of □mm at high speed.
, Compatible with general-purpose transfer device
It can transfer the top kit, mounting solder, flux, etc. to the protruding parts with high precision, and has excellent versatility.
Excellent interchangeability with M series products
The modular design concept ensures interchangeability with M series products.
Continuity and evolution of expanded production
To expand production scale, only a small initial investment is needed to expand production in stages.
In addition, the latest technological level accumulated in the M series products can be upgraded and evolved after delivery with only a small investment.
Machine name
Model MB
Substrate size (mm)
High-speed placement head nozzle
Placement speed/chip (type)
Paste Mounting accuracy mm/chip (≧)
Component size (mm) chip*
Universal placement head nozzle
Mounting speed/chip (type)
Mounting accuracy mm /Chip, mm/Q
Component size (mm) Chip**
Multifunctional placement head nozzle
Placement speed/Q (Type B)
Placement accuracy mm/Q (≧)
Component size (mm) Chip*
Substrate replacement time is approx. (When there are no mounted components on the back)
Three-phase power supply, , , , ,
Air pressure source*M, /(..R.)
Equipment size* (mm) H *
Weight*