- 导热系数：
- 3.0W/m-K
- 规格：
- 304.8 mm *304.8 mm
- 厚度：
- 0.25mm 0.38mm 0.51mm 1.02mm 1.52mm 2.03mm 2.54mm 3.18mm
广东销售贝格斯硅胶片填充片Gap Pad3000S30高导热绝缘片导热系数3.0W
柔软有基材间隙填充导热材料
Gap Pad3000S30规格：
8款厚度：0.25mm 0.38mm 0.51mm 1.02mm 1.52mm 2.03mm 2.54mm 3.18mm
整张规格：203*406MM
硬度：Bulk Rubber(Shore 00):30
击穿电压（Vac）:>3000
导热系数：3.0W/m-K
浅蓝色
Gap Pad3000S30特点：
在非常低的压力下，低的S系列热阻
高的贴服性，S系列软度
针对低应力应用设计
玻纤增强，提高加工性能和搞斯裂性
Gap Pad3000S30应用：
处理器，服务器S-RAMS,大容量存储驱动器，有线/无线通讯硬件，笔记本电脑，BGA封装，功率转换器
Gap Pad导热界面材料系列以更好的贴服性，更高的导热性能及易于应用来满足电子工业对导热界面材料的日益增长的需要；在凹凸不平的表面，空气间隙和表面粗糙的散热器与电子元器件之间，广泛的Gap Pad系列提供一个有效的导热界面。
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