Shenzhen [Chuangyan] Stainless steel polishing powder Ceramic polishing powder Glass polishing powder

Product Introduction
Polishing powder is usually composed of cerium oxide, aluminum oxide, silicon oxide, iron oxide, zirconium oxide, chromium oxide and other components. Different materials have different hardness and different chemical properties in water, so the use occasions vary. Aluminum oxide and chromium oxide have a lower Mohs hardness than cerium oxide and zirconium oxide than iron oxide. Cerium oxide and
silicate glass
have higher chemical activity and comparable hardness, so they are widely used in glass polishing.
Product Display
Our Advantages
Characteristics of Chuangyan Polishing Powder
Polishing powder has the advantages of fast polishing speed, high smoothness and long service life. Compared with traditional polishing powder, iron red powder does not pollute. It has the advantages of being easy to remove from stains
It takes
minutes to polish the lens with cerium oxide polishing powder in one minute, such as using iron oxide polishing powder. Therefore, rare earth polishing powder has the advantages of low dosage, fast polishing speed and high polishing efficiency. And it can change the polishing quality and operating environment.
The reason why cerium oxide is an extremely effective polishing compound is that it can simultaneously polish glass using both chemical decomposition and mechanical friction.
Scope of application of grinding powder
In addition to having the same uses as green silicon carbide micro powder and white corundum micro powder, it is mainly suitable for grinding and polishing and ultra-fine grinding and polishing in optical, electronic, precision mechanical instrumentation and other industries.
Product Usage
Polishing powder has excellent chemical and physical properties, so it has been widely used in the polishing of industrial products. For example, it has been used in various optical glass devices, TV picture tubes, optical spectacle lenses, oscilloscope tubes, flat glass Polishing of semiconductor wafers and metal precision products.
Our advantages
The particle size of the micron powder is uniform and within the allowable range
It has high purity and does not contain mechanical impurities
It has good dispersion and adsorption to ensure the processing process It can be added in an appropriate amount to be uniform and efficient
The dispersant improves the suspension rate
The powder particles have a certain lattice shape and form sharp corners when broken to improve polishing efficiency
They have suitable hardness and density and Water has good wetting and suspending properties because polishing powder needs to be mixed with water.
Product Application
Cooperating Customers
Qualification Certificate
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