- 贴装速度:
- 0.12 s/芯片
- 贴装精度:
- ±50μm/芯片 (Cpk≧1) 、±30μm/QFP(Cpk≧1)
- 设备尺寸:
- W1950 × D1500 *3 × H1500 *4 W1950 × D1710 *3 × H1500 *4
Model name
Model-
Board size
Mounting speed./chip
Mounting accuracy/chip (≧), 3/(≧)
Number of components mounted (Double taping rack:)
Component size** chip
Substrate replacement time*
Three-phase power supply,,,,
Air pressure source./(..R .)
Equipment size*3**3*
Weight*(fixed supply specification)(fixed supply specification)
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