Precision instrument cold storage Electronic instrument cold storage

Xiamen Cold Storage Electronic Materials Cold Storage Precision Instrument Cold Storage Electronic Instruments Cold Storage
Xiamen Liya Industry and Trade Co., Ltd. designs and produces various large, medium and small refrigerators, freezers, air-conditioned storage, fresh-keeping cold storage, quick-freezing storage, and logistics cold storage , pharmaceutical storage warehouses and various experimental cold storages, constant temperature warehouses, explosion-proof cold storages and other types of cold storages, including assembled cold storages and civil cold storages.
High temperature warehouse (℃～℃), medium temperature warehouse (-℃～℃), low temperature warehouse (-℃～-℃), quick freezing warehouse and various ultra-low temperature cold storages (℃- -℃), or low temperature constant temperature and humidity , low temperature and low humidity cold storage.
Advanced electronic products are derived from cooling. At present, complementary metal oxide semiconductor (CMOS) chip technology is used as the main category of integrated circuits. Cold storage is widely used in microprocessors, microcontrollers, static random access memories ( R) and other digital logic circuits. As capabilities continue to rise, there is a strong demand for cooling to ensure performance of microprocessors, microcontrollers, static R, and other digital logic circuits. In particular, it is known that the performance of cold storage can be greatly improved if the temperature can be further reduced. There are many advantages: for example, higher carrier mobility, high saturation speed, better conduction function (sub-threshold slope), cold storage latchup immunity, improved reliability, activation of degradation processes, reduced power consumption, in leakage current , which reduces interconnect resistance, improves thermal conductivity, and reduces thermal noise, in addition to low-temperature operation.
In addition, it is known that cold storage causes significant improvements in the performance of semiconductor devices operating at lower temperatures. This is because semiconductor devices switch times faster, increasing the speed of circuits due to the lower resistance of interconnect materials operating at lower temperatures. Depending on the doping characteristics, performance improvements can be achieved ranging from up to 3 per [degree] ([degree]) temperature reduction of the transistor. However, cold storage is increasingly difficult to manage, and in addition to shrinking integrated circuits, there are physical limitations on the size of the heat generated. In fact, advanced electronics are suffering from a sharp rise in cooling requirements. Although traditional air cooling still dominates the cooling solution for cold storage, it suffers from issues such as noise and reduced heat transfer performance. Therefore, alternatives such as heat pipes, liquid immersion, jet impingement and spray, thermoelectric materials for cold storage, and refrigeration must be considered . Among the available alternatives, thermoelectric cooling alone can provide a sub-operating environment that is quite attractive for high-throughput applications.
In practice, refrigeration is capable of operating in high-temperature environments, but its performance coefficient (Coefficient of Performance) level is much higher than that of current thermoelectric systems. Others use refrigeration to cool down, such as low junction temperature, high energy consumption and heat flux maintained at a lower operating temperature, which has the potential to improve microprocessor performance, and cold storage improves chip reliability. The investigation of electronic equipment cooling using refrigeration reports mainly relates to basic system performance, such as junction, ambient air, thermal resistance, refrigeration system, and transient response behavior of cold storage systems. Some refrigerated electronics are already on the market.
However, as Aguwu points out, cold storage has two major problems in using refrigeration systems to cool electronics. The first is related to the surface-subject condensation operating environment, and the second is the hysteretic response of the system to the evaporator load. Note that condensation occurs at temperatures below the dew point temperature of the surrounding air. Condensed water can cause harm to electronic systems and must be avoided at all times. Typical solutions may involve clumsy insulation or the use of additional heaters to evaporate condensate outside the cold plate. The former requires a large amount of space, which is often quite limited, and in practice tends to reduce overall system performance due to stagnant airflow. The latter design not only raises control issues but also incurs additional energy consumption. In view of the shortcomings of these two common solutions, our company offers a new design that completely eliminates the effects of condensation. The cold storage concept is then proposed, and the performance is compared with that of a conventional cold plate.