Alkali-free copper pre-plating solution

包装：

桶装

规格：

25kg/桶

Process characteristics: The alkali-free copper pre-plating solution is a new generation of copper-free plating process developed by our company with the latest foreign technology. Its characteristics are as follows:
No need is required, and it is very suitable for steel parts, brass parts, aluminum alloys, etc. Zinc alloy workpieces are electroplated as the bottom layer, with strong bonding force
The plating solution is stable and reliable, with long service life
The plating solution has strong activity, large cathodic polarization potential, the coating can be thickened, high brightness, and non-brittle
Wastewater treatment is easy. You only need to add precipitant to remove organic matter and meet discharge standards.
Solution composition and operating conditions:
Raw materials and operating conditions
Rack plating
Barrel plating
Pure water
ml/L
ml/L
Renchang alkali-free copper pre-plating solution
ml/liter
ml/liter
Renchang alkali-free copper pre-plating solution
ml/liter
ml /liter
value


temperature
(-)℃
(-)℃

(.)
.(.)



Anode
Rolled high-purity copper plate
Rolled high-purity copper plate
Time
- Minutes
Minutes
Stirring
Cathode movement or air stirring (as appropriate)
Cathode movement or air stirring (as appropriate)
Filtration
Continuous filtration
Continuous filtration

Preparation of plating solution (rack plating, taking as an example)
Add deionized water to the plating tank, add solution (containing copper), and stir.
Use solution to adjust the value and control the solution value.
Add B brightener, stir, add deionized water to reach the working volume, and stir evenly.
Heat to working temperature and test plating.
Control and maintenance of plating solutions
Plating concentrates provide copper for the base matrix. During the electroplating process, the deposited copper is replenished by anodic erosion. The complex elixir brought out is supplemented by Add B. Generally, it can only be added when the new tank or plating solution is exhausted. The copper content in the plating bath is generally maintained at ~/ for rack plating and ~/ for barrel plating. During the production process, due to the loss of the plating solution and the loss of the electrode process, it can be replenished based on chemical analysis. If there is a lack of copper /, it can be replenished /. (, B)
The B replenishing solution contains complex chemicals. Its addition can be used as a supplement for the brought out and the amount consumed due to electrochemical effects. Too little will cause a decrease in binding force, and a slight excess will not cause anything. adverse effects. B supplementary solution contains strong acidic substances, so add it carefully and adjust the potassium hydroxide value after adding it. The consumption of B is about ~/, which can also be added according to the Hall tank test.
The value of the plating solution should be controlled at .~, not lower than it, so as not to affect the bonding strength of the coating. Use 3 for higher values and B for lower values.
The anode material is preferably rolled high-purity copper plate. In order to prevent the anode mud and copper powder from contaminating the plating solution, it is best to use a nylon sleeve and continuously filter the plating solution.
It is necessary to strictly prevent metal ions such as iron, copper, nickel, and chromium from contaminating the bath liquid, which will cause the appearance of the coating to deteriorate, causing defects such as fog, rough crystallization, and dark red color.