BGA underfill/chip underfill/IC underfill/underfill

Supply glue chip B special glue B filling glue/filling glue, bottom filling glue, transparent B chip filling glue, transparent bottom filling glue, bottom filling glue black glue, sales: .3......3.... Chen Sheng...Website/Address:............/ The underfill developed by our company can quickly penetrate between B and other chips and circuit boards, and has excellent filling characteristics. After curing, it can alleviate temperature shocks and absorb internal stress, strengthening the connection between B and the substrate, thereby greatly enhancing the reliability of the connection. Underfill also has very good reworkability, making it possible to reuse expensive components and circuit boards. Shenzhen supplies glue chip B special glue production glue factory, bottom filling glue factory