SZLP25B (2.5m) CNC self-swinging ring polishing machine

磨盘直径：

Φ2500

盘面跳动：

≤0.05mm

单点跳动：

≤0.01

--(.m) CNC self-oscillating ring polishing machine
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This machine tool is used for large-scale grinding and polishing of high-precision optical, electronic, ceramic, silicon wafer, mechanical seal and other flat components. Equipment (referred to as ring polishing machine).
The machine tool correction plate mechanism adopts the company's patented (.) air pressure unloading device. The contact pressure between the correction plate and the grinding plate can be controlled at any time by unloading and regulating within a range of ~ and there is a pressure gauge display to maintain the durability of the surface shape of the grinding plate. This machine tool is equipped with an asphalt grooving machine that can process asphalt flat surfaces, straight grooves, and circumferential grooves. Various groove shapes can be machined after trimming the tool. After trimming, the grooving machine can be disassembled as a whole and placed separately without affecting the normal use of the machine tool. The machine table and water basin are made of stainless steel, which is beautiful, corrosion-resistant and easy to clean. The whole machine is based on the requirements of high-precision plane processing technology. The program control design is compact and reasonable. The body is rigid and vibration-free.
Main technical parameters
Grinding disc diameter
>
Disk surface runout
>.
>Single point runout
>.
>Operation Interface
>Calibration disc specifications*
Water basin diameter
Grinding disc speed ~ rpm (servo stepless)
> Driving wheel speed
~ rpm (servo Stepless)
Caliper moving distance
Total power is approx./
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>Machine tool volume**
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>The total machine tool weight is approx.