Moving plate splitter

Product Description

The blade is recessed inside the device and has an anti-pinch function.


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All existing boards are applicable.


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Separate by machine to reduce stress and prevent solder joints from cracking.


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The thickness of the substrate that can be cut and the height limit of the parts above and below the substrate.


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The thickest one can be folded and the length is unlimited.


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The height of the track is adjusted by centigrade, and the low control determines the depth.


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The divided working hours are fixed to ensure product quality.


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Revolution
Number
The speed can be controlled according to the length or shortness of the board.


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High accuracy, easy maintenance and high safety.


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The machine is lightweight, does not take up space, and is easy to operate.

, machine appearance dimensions length * width * height (machine width)



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This product can cut paper, so the The stress generated is very small, there is no burr when dividing the board, the cutting surface is smooth, and the damage to the board is very small.



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This product is a new product developed by our company. It cancels the dovetail groove component on the old equipment and uses a spiral type to adjust the height of the blade. The speed is more convenient, more accurate, and not easy to loose

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For ultra-high parts above and below the board, such as power supplies, orders can be accepted.