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Solder paste thickness gauge

total supply
0
MOQ
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brand
SH-110-3D
area
JiangsuSuzhou City
Delivery period:
Shipped within 3 days from the date of payment by the buyer
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area:Jiangsu Suzhou City

Member level:corporate memberYear1

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Kunshan Huayunmao Electronics Co

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Product Details

Automation of measurement procedures, high repeatability, intelligent analysis system
, large-scale measurement, meeting the requirements for large plate measurement
, high interpretation, the most precise laser head, ensuring high and stable measurement accuracy
, Color image size inspection function
, Accurate analog measurement function
, High-precision repeated measurement, automation of measurement procedures
, High-precision design of rigid structure to eliminate environmental impact
, Completely intelligent analysis system
, Axis automatic focus correction, automatic data compensation when the plate is abnormal or bent after passing the furnace
Product features
, Scanning measurement, simulated observation
, Multi-area Programming scanning
, automation, repeatable measurement
, large scanning range
, axis servo, software correction, automatic plate bending compensation
, anti-plate bending fixture
, one Press the key to open the cover (transparent cover can be customized)
, five-level field of view adjustment
, powerful functions
, product and production line management
, automatic measurement mode, scanning is completed Alarm and automatically turn off the red laser ray to ensure the service life of the laser lamp.
According to the different brightness and the brightness of the surrounding environment, the illumination brightness of the laser ray and shadowless lamp can be adjusted from the darkest to the strongest.
Function introduction
The solder paste thickness gauge is a new generation of solder paste measuring instrument. It is equipped with a control system, high-precision three-axis drive and superior hardware configuration. It complements its simple and exquisite appearance design. It will give You bring simplicity, speed and efficiency to your measurement work. Suitable for full board inspection, it can detect solder paste thickness, volume, area, position deviation, defective shape, less tin, more tin, continuous tin, missing prints and other defects.
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