Year1
- 速度：
- 0.08秒/CHIP（IPC9850条件）
- 贴装精度：
- ±0.05mm/CHIP、±0.05mm/QFP（標準部品使用時）
- 贴装范围：
- 01005－20MM*20MM
Speed/(condition)
, (/conversion)
, (/conversion)
Type (, テープconversion)
Substrate size method~
Substrate thickness/substrate weight
Substrate conveying direction right and left, (left and right)
Absolute accuracy (+) /, / (when standard parts are used)
缲り回し accuracy /, / parts Number of types Parts supply form, ~□ parts, /,,
ヘッド The allowable height of the top surface of the base plate before loading is less than the allowable height, and the parts that can be mounted are higher
Standard ヘッド The allowable height of the top surface of the base plate before loading is less than the allowable height of the parts that can be mounted High power
Power supply specification three-phase
Power supply capacity
Average power consumption standard (hour)
Supply source, /, clean and dry condition
Dimensions, ,,
The body mass is about,
WhatsApp
