- 贴装精度:
- :±0.1mm/CHIP ±0.08/QFP
- 贴装速度:
- 0.25秒/CHIP 1.7秒/QFP
- 基板尺寸:
- L460*W250(Max)/L50*W50(Min)
Substrate size (end placement) assembly*/*
Substrate thicknessbr/> Substrate transfer direction right and left
Mounting accuracy
Mounting speed
Original type strip Original parts with conversion)
Used when pallet original parts are used)
Original parts are supplied in the form of wide strips, rods, bulk, pallets
Placement of original parts ~ (
Three-phase power supply, /< br/> Power
In terms of air pressure,
Dimensions**
Weight
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