- 贴装速度：
- 0.28秒/CHIP
- 装着精度：
- ±0.05mm/CHIP、±0.05mm/QFP
- 基板寸法：
- L460×W330mm（Max）～L50×W50mm（Min）
Optimum conditions/
Conditions, (/conversion) parts that can be mounted, parts, /,, コネクタ,, /
Substrate size method~
Substrate thickness
Substrate weight
Mounting accuracy, absolute accuracy (+) /, /
Installation accuracy /, /
The allowable height on the base plate before loading is less than or equal to
The parts that can be mounted are high
Power supply specification Three-phase/
Power supply capacity
Average power consumption
Supply source,/, clean and dry state
Dimensions,,,
Body mass approx.
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】，By Titker Trade Network members 【Shenzhen Luyuan Automation Equipment Co
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