Year1
- 贴装速度：
- 0.25s/芯片
- 贴装精度：
- ±50 μm/芯片 (Cpk≥1)、±30 μm/QFP(Cpk≥1)
- 元件搭载数量：
- 60（双式编带料架：120）、托盘：80
< > B
< > Model number
< > B
< > Board size ()
< > ~
< > Mounting speed
< > .Chip
< > Mounting accuracy
< > Chip (), ()
< > Number of components loaded
< > (Double tape rack:), tray:
< > Component size ()*
< > Chip~r
< > Board replacement time*
< > .(In case of high-speed transport specifications, *)
< > Power supply
< > Three-phase,,,,,,,.
< > Air pressure source
< > .,(..)
< > Equipment size ()< br/> < > **
< > Weight*
< > (Fixed supply specification)
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