High frequency plate hole forming agent YC-800

In terms of high-frequency microwave communication and high-speed transmission of digital long-distance information, B substrates are required to have low dielectric constant, low dielectric loss factor, and good high temperature resistance. There are many such high-frequency substrates, such as polybutylene. Polyethylene, polyphenylene ether, cyanate ester, etc., but currently the most widely used ones are mainly polytetrafluoroethylene.
Polytetrafluoroethylene () is widely used in various high-frequency microwave environments. It has excellent electrical properties such as low dielectric number, low dielectric loss, high temperature resistance and corrosion resistance. However, the surface of polytetrafluoroethylene material It is difficult to be roughened and infiltrated, so there are certain difficulties in circuit board production, such as hole metallization () process, solder mask process, character process, etc. In particular, hole metallization () is a difficult problem that plagues Factory B.
Polytetrafluoroethylene
Physical properties: low dielectric constant, high dielectric strength, small dielectric loss factor, good semi-flame retardancy, and good heat resistance.
Chemical properties: Strong chemical corrosion resistance
In order to solve the problem of difficult hole metallization (), our company has specially developed a high-frequency plate hole shaping agent. It is a unique highly active weak alkali cleaning and adjusting agent, especially suitable for hole wall and charge adjustment on high-frequency printed circuit boards, and has the effect of removing organic dirt (light oil), which can greatly improve the performance of high-frequency printed circuit boards. The ability of the hole wall catalyst makes the high-frequency plate's one-time copper deposition pass rate reach %, and the operation is simple, so that the ordinary plate with the high-frequency plate holeization process can also achieve the purpose of mass production.