Guangdong DOW CORNING TC-5022 heat sink thermal grease

recently announced the launch of R's new thermal grease, which can provide high thermal conductivity and low ownership cost for high-end microprocessor packages. Its thermal conductivity is on average % to % higher than the thermal grease currently on the market, and is suitable for various heat dissipation applications. fins, including lower-cost heat sinks, thereby reducing the user's total manufacturing costs. It can make the interface thickness (B) below micron, allowing manufacturers to obtain extremely low thermal resistance (.℃).
This new material has excellent long-term thermal stability, and the processing process is not affected by pressure, providing users with a wide range of process applications to improve manufacturing stability, reusability and overall yield. The company stated that because the package heat dissipation management of the new generation of flip-chip microprocessors is more difficult, thermal grease and other thermal interface materials have become important considerations in its R&D and design process. In addition to thermal grease, r also offers a wide range of thermal interface materials, including thermal pads, thermal films and gels, to meet various thermal management requirements in the industry.
Dongguan Xiaoxi Trading Co., Ltd.
Tel: