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本公司独创专利技术生产的铜铝复合材料:板、带、箔,主要参数:厚度0.1-14mm,宽度600-1000mm。在高温真空高压下解决了铝

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LED substrate uniform temperature aluminum substrate copper aluminum composite substrate

价格 58.00元/盒
total supply
4568 盒
MOQ
0 盒
brand
联达
area
HenanLuoyang City
Delivery period:
Shipped within 3 days from the date of payment by the buyer
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area:Henan Luoyang City

Member level:待审核会员Year1

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洛阳铜一金属材料发展有限公司

  • name:尚爱平(sir) 营销总监
  • phone:0379-65199551
  • mobile phone:13613892625
  • address:建设路50号
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Product Details
Luoyang Lianda Mechanical and Electrical Technology Development Co., Ltd. is located in Luoyang, the ancient capital of the Nine Dynasties. It is a comprehensive professional high-tech enterprise integrating the research, development, production and sales services of new metal materials. It is the most authoritative metal composite material research and development and production enterprise in China. The main parameters of copper-aluminum composite sheets, strips and foils produced by original patented technology are thickness and width. Under high temperature, vacuum and high pressure, major technical bottlenecks such as the oxidation of aluminum and the eutectic reaction of copper and aluminum are solved. The metallurgical composite between copper and aluminum has no non-metallic medium and combines the electrical and thermal conductivity properties of pure copper and pure aluminum. The products are divided into conductive categories. Large series of thermal conductive, decorative and deep drawing types. The main products include copper-aluminum composite plate with foil, copper-aluminum composite row copper-aluminum transition plate, copper-aluminum transition row copper-aluminum composite gasket encapsulation copper-aluminum composite metal substrate, copper-aluminum composite copper door material curtain wall panel, copper-aluminum composite tableware material, etc. The copper-aluminum composite board specially developed by our company for packaging uses the excellent properties of copper heat conduction and aluminum heat dissipation to form a good heat conduction channel. It is an excellent heat conduction material that replaces pure copper and pure aluminum substrates. Sales hotline Mr. Shang
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