SZLP22B CNC self-swinging ring polishing machine

磨盘直径：

Φ2200mm

盘面跳动：

≤0.05mm

单点跳动：

≤0.01mm

--> CNC self-oscillating ring polishing machine
This machine tool is a large-scale grinding and polishing equipment for high-precision optical, electronic, ceramic, silicon wafer, mechanical seal and other flat components (referred to as ring polishing machine).
The machine tool correction plate mechanism adopts the company's patented (.) air pressure unloading device. The contact pressure between the correction disc and the grinding disc can be controlled at any time by unloading and regulating within a range of ~ and there is a pressure gauge display to maintain the durability of the surface shape of the grinding disc.
This machine tool is equipped with an asphalt grooving machine that can process asphalt flat surfaces, straight grooves, and circumferential grooves. Various groove shapes can be machined after trimming the tool. After trimming, the grooving machine can be disassembled as a whole and placed separately without affecting the normal use of the machine tool. The machine table and water basin are made of stainless steel, which is beautiful, corrosion-resistant and easy to clean. The whole machine is based on the requirements of high-precision plane processing technology. The program control design is compact and reasonable. The body is rigid and vibration-free.
Main technical parameters
Grinding disc diameter Water basin diameter
>
Disk surface runout
>. Grinding disc speed ~ rpm (servo stepless)
Single point Runout
>. Driving wheel speed ~ rpm (servo stepless)
Processing range
> Caliper moving distance
>Total power of operation panel/
>Calibration disk Specifications*
>Total volume of machine tool/*
Total weight of machine tool is approx.