Zhongshan solder paste wholesale

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Lead-free solder paste, because the melting point of the alloy is higher than the temperature of lead solder paste, or even higher, causing the soldering temperature to increase and energy consumption to increase. Some electronic components cannot withstand such temperature. High temperatures may cause damage, so it cannot be directly used in existing production processes and equipment.
It is difficult to accurately control the alloy composition of quaternary or even quintuple alloys during wave soldering production, and it will also become difficult during reflow soldering due to the multi-component alloy. There is not much research and development on the system technology and solder paste supporting the new lead-free solder paste, causing the cost of lead-free solder paste to be significantly higher than that of lead-based solder paste.
Compared with assembly, lead-free rework requires higher temperatures and longer heating times. Since lead-free surface assembly will have a greater impact on the manufacturing process, lead-free solder paste processes and equipment need to be adjusted accordingly.
The most important point is reliability. The increasingly higher reliability requirements of electronic products, in addition to further improving the performance requirements of the components themselves, also require the joint connection material, that is, solder paste, to have good physical properties, electrical conductivity, thermal conductivity, thermal matching ability, good mechanical properties, joint creep resistance, Thermal fatigue performance, corrosion resistance, good process performance and environmental compatibility, etc.
During the service process of brazed electronic structures, there are usually the following problems: expansion coefficient mismatch, fatigue, mechanical fatigue, texture, unstable corrosion environment, etc. The existence of these problems makes the brazed joints likely to fail prematurely during service.
The comprehensive lead-free trend in the electronics industry requires that the soldering pads and component connection terminals or leads used as assembly objects must also be completely lead-free and must be compatible with the new lead-free solder paste. Therefore, there is still a long way to go to achieve comprehensive lead-free.
With the miniaturization of components and the development of surface assembly technology, the microstructure stability and mechanical properties of soldered joints used in the electronic information industry, especially the creep resistance, have become higher. Require. Nowadays, the whole world is committed to researching lead-free solder. Until now, no ready-made material has been found that can be used as a substitute for lead-containing solder paste. In order to improve the service capabilities of lead-free solder paste, much research focuses on adding nano-scale or micron-scale reinforced particles to lead-free solder paste to create composite solder paste. The purpose of developing composite solder paste is to improve the effective operating temperature range of the solder paste by maintaining a stable fine-grained structure and uniform deformation inside the solder paste, thereby comprehensively improving the performance of the soldered joint, especially the resistance to thermal fatigue and Creep resistance. Therefore, the development of lead-free composite solder paste can be said to be an effective way to seek alternatives. Lead-free solder paste is also developed based on considerations of service reliability.
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