Lead-free solder paste, lead-free solder paste manufacturer, high-quality lead-free solder paste

Lead-free solder paste
Introduction:
The lead-free series is a lead-free, no-clean solder paste that uses imported organic active agents, high boiling point organic solvents, surfactants, natural organic acids, and polymer ingredients. It is formulated with film agents, adhesives, antioxidants, etc. It has excellent weldability, good wettability, moderate activity of flux, and spherical alloy powder with very little oxide content. Nitrogen protection is added under sealed vacuum conditions to ensure the production of the best quality solderless products
Lead solder paste.
Features of lead-free solder paste:
: In high-speed continuous printing, consistent results can be obtained with good stability.
: Moderate viscosity, good thixotropy, not easy to collapse, no bridging, no false welding.
The residue after welding is very small, transparent, has a large insulation resistance, will not corrode the B board, and can meet the no-cleaning requirements.
Lead-free solder paste
Type classification: lead-free silver-containing solder paste, lead-free low-temperature solder paste, lead-free medium-temperature solder paste, lead-free high-temperature solder paste, lead-free solder paste.