Tin slag antioxidant and reducing agent, wave soldering antioxidant and reducing agent, lead-free antioxidant and reducing agent

Antioxidant-reducing agent
Introduction:
This product is a white powder that integrates anti-oxidation and reducing effects. It is mainly added to the solder surface of various tin furnaces (manual dip soldering, wave soldering) to protect the surface solder from oxidation and has strong reducing properties, reducing the generation of tin slag, thereby reducing costs. Directly applied to the surface of tin slag, it is easy to use and effective.
Anti-oxidation reducing agent
Features:
: The powder dissolves on the solder surface and quickly forms a white protective film to isolate the solder surface from the air and minimize the occurrence of oxidation.
: Complies with the no-clean standard requirements, the bottom of the board is clean, it will not have a negative impact on the cleanliness of B, and will not cause adverse reactions to solder, flux, and various materials on the B board.
It has a long effective life, and the validity period is usually about an hour after adding it once.
: It not only prevents the occurrence of oxidation, but also has excellent reducing ability for the formed tin slag. The best reduction rate can be achieved above.
Antioxidant-reducing agent
Variety classification: lead-free antioxidant-reducing agent, wave soldering antioxidant-reducing agent, tin slag antioxidant-reducing agent
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