Supply of filling bonding and heat dissipation silicone between high-power electrical modules and radiators

规格：

310ML/支

Supply of filling bonding and heat dissipation silicone between high-power electrical modules and radiators. The color is white semi-fluid, the color is black paste, the color is translucent. Curing at room temperature, surface drying time: minutes, fully cured, working temperature ~℃ .
Typical uses are widely used in filling and bonding between thermal conductive pads, radiators, transistor intelligent control modules and radiators, junctions between transistors and electric thermistors, high-power electrical modules and radiators, and heat dissipation. After using this glue, the traditional connection method of cards and screws can be eliminated. The result is more reliable filling and heat dissipation, simpler industry, and more economical cost.
For example, it can be widely used in integrated circuits, mechanical processing agents, high power, memory modules, cache memories, sealed integrated chips, converters, and other power modules, semiconductors, chargers, and rectifiers for personal portable computers. etc. packaging.