Hefei Electronic Product R&D Circuit Board Prototyping Printed Board Processing

Causes of plating layer delamination during the electroplating process in circuit board factories
Holes appear in dry film masking
Many customers believe that after holes appear, the circuit board factory should increase the temperature and pressure of the film to enhance its bonding force , in fact, this view is incorrect, because when the temperature and pressure are too high, the solvent in the resist layer of the circuit board factory evaporates excessively, making the dry film brittle and thin, and it is easy to be punctured during development, so we must always maintain Dry film toughness.
The exposure energy is too high or too low
Under ultraviolet light irradiation, the photoinitiator that has absorbed the light energy decomposes into free radicals to initiate monomers for photopolymerization, forming a solution that is insoluble in dilute alkali. molecular. When the exposure is insufficient, due to incomplete polymerization, during the development process of the circuit board factory, the film swells and becomes soft, resulting in unclear lines and even peeling off of the film, resulting in poor bonding between the film and copper. If it is overexposed, it will cause difficulty in development and also cause problems in the film. During the electroplating process, warping and peeling occur, forming seepage plating. So it is important to control the exposure energy.
After the copper surface in the circuit board factory is treated, the cleaning time should not be too long, because the cleaning water also contains a certain amount of acidic substances. Although its content is weak, the circuit board factory cannot take it lightly, and should strictly follow the Carry out cleaning operations at the time specified in the process specifications.
The main reason why the gold layer of the circuit board factory peels off from the surface of the nickel layer is the surface treatment of nickel. Nickel metal has poor surface activity and it is difficult to achieve satisfactory results. The surface of the nickel plating layer is prone to produce a passivation film in the air. If not handled properly, the gold layer will be separated from the surface of the nickel layer. If the activation is improper during gold electroplating, the gold layer will detach from the surface of the nickel layer and peel off. The second reason is that after activation, the cleaning time is too long, causing a passivation film layer to be regenerated on the nickel surface, and then gold plating is performed, which will inevitably cause the coating to fall off.
Zhongtian Yuan Circuit Board Co., Ltd. is a high-tech enterprise in Zhengzhou specializing in the R&D, production and processing of B circuit boards, multi-layer printed boards and aluminum substrates. >