Hefei pcb welding processing circuit board proofing

Circuit board factory B, also known as printed circuit board, is one of the important components of electronic products. Printed wiring is a conductive pattern formed on the surface or inside of an insulating substrate using a printing method according to a pre-designed circuit for connection between components. Electronic products from circuit board factories have the advantages of high reliability, good consistency, high mechanical strength, light weight, small size, and easy standardization.
The invention of single-sided copper-clad laminates in circuit board factories has become a symbol of a new era of circuit board design and production. Wiring design and production technology have matured. First, use a template to print the anti-corrosion film pattern on the copper-clad board, and then etch the etched lines. This technology is as simple as printing on paper, hence the name of printed circuit board. The application of printed circuit boards has greatly reduced production costs. With the development of electronic technology and the advancement of printed circuit board technology, double-sided boards have appeared, that is, copper is applied on both sides of the board, and the etched lines can be corroded on both sides.
With the development of electronic product production technology in circuit board factories, people began to develop interlayers based on double-sided circuit boards. In fact, they are superimposed on a double-sided circuit board with a single panel, which is a multi-layer circuit board. At first, the mezzanine was mostly used for the wiring of large-area ground wires and power wires, and the surface layer was used for signal wiring. Later, more and more interlayers were required for signal wiring, which required an increase in the number of layers on the circuit board. However, interlayers cannot be increased indefinitely, mainly due to cost and thickness issues.
Zhongtian Yuan Circuit Board Co., Ltd. is a high-tech enterprise in Zhengzhou specializing in the R&D, production and processing of B circuit boards, multi-layer printed boards, and aluminum substrates
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