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Common faults and solutions for circuit board manufacturers’ film lamination
． The dry film is not firmly attached to the copper foil of plate B
The surface of the copper foil is not clean, with oil stains or oxide layers. Clean the board again and wear gloves when operating.
The solvent in the dry film solvent evaporates and deteriorates. Store at low temperature and do not use expired dry film.
The transmission speed is fast and the B film temperature is low. Change the B laminating speed and B laminating temperature.
The ambient humidity is too low. Maintain relative humidity in the production environment.
． Bubbles appear between the dry film and the surface of the copper foil of the circuit board
The surface of the copper foil is uneven, with pits and scratches. Increase the B film pressure, and handle the board with care when transferring it.
The surface of the hot press roller is uneven, with pits and film stains. Pay attention to protecting the smooth surface of the hot pressing roller.
B film temperature is too high, lower B film temperature.
3. The dry film of the circuit board is wrinkled
The dry film is too sticky, so place the board carefully.
B The board is too hot before applying the film, and the preheating temperature of the board should not be too high.
． Remaining glue on board B
The dry film quality is poor, replace the dry film.
The exposure time is too long, shorten the exposure time.
If the developer fails, replace the developer.
Zhongtian Yuan Circuit Board Co., Ltd. is a high-tech enterprise in Zhengzhou specializing in the R&D, production and processing of B circuit boards, multi-layer printed boards, and aluminum substrates
We have always put quality first and customer first. As our service tenet, we provide you with considerate service. We welcome customers and friends to call us for consultation and purchase negotiation!
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