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The die substrate is mainly used as a medium for heat energy export between the die and the system circuit board, and is combined with the die through wire bonding, eutectic or flip-chip processes. Based on heat dissipation considerations, the main grain substrates on the market are ceramic substrates. Based on different circuit preparation methods, they can be roughly divided into three types: thick-film ceramic substrates, low-temperature co-fired multi-layer ceramics, and thin-film ceramic substrates. In traditional high-end ceramic substrates, Power components mostly use thick film or low-temperature co-fired ceramic substrates as the die heat dissipation substrate, and then use gold wires to combine the die with the ceramic substrate. As mentioned in the introduction, this gold wire connection limits the effectiveness of heat dissipation along the electrode contacts. Therefore, major manufacturers at home and abroad are working hard to solve this problem. There are two solutions. One is to find substrate materials with high heat dissipation coefficients to replace alumina, including silicon substrates, silicon carbide substrates, anodized aluminum substrates or aluminum nitride substrates. Among them, silicon and silicon carbide substrates are semiconductor materials. Characteristics make it encounter more severe tests at this stage. However, the anodized aluminum substrate is prone to conduction due to fragmentation due to insufficient strength of the anodized oxide layer, which limits its practical application. Therefore, at this stage, The more mature and generally accepted one is to use aluminum nitride as a heat dissipation substrate. However, the current limitation is that aluminum nitride substrates are not suitable for traditional thick film processes (the material must be subjected to atmospheric heat treatment at ℃ after silver glue printing to make it appear Material reliability issues), therefore, aluminum nitride substrate circuits need to be prepared using a thin film process. The aluminum nitride substrate prepared by the thin film process greatly accelerates the efficiency of heat transfer from the die to the system circuit board through the substrate material, thus greatly reducing the burden of heat from the die to the system circuit board through the metal lines, thereby achieving high heat dissipation effect. .
Zhongtian Yuan Circuit Board Co., Ltd. is a high-tech enterprise in Zhengzhou specializing in the R&D, production and processing of B circuit boards, multi-layer printed boards, and aluminum substrates
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