Product Details
Learn the basics of circuit boards
Characteristics of aluminum-based circuit boards
.Adopt surface mounting technology
.Extremely effective treatment of thermal diffusion in circuit design
3. Reduce Product operating temperature, improve product power density and reliability, extend product service life
.Reduce product size, reduce hardware and assembly costs
.Replace fragile ceramic substrates to obtain better mechanical durability .
Structure of aluminum-based circuit board: Aluminum-based copper-clad laminate is a metal circuit board material, consisting of copper foil, thermally conductive insulating layer and metal substrate. Its structure is divided into three layers
.r circuit layer: Equivalent to ordinary B copper-clad laminate, the thickness of the circuit copper foil is .
rrInsulation layer: The insulation layer is a layer of low thermal resistance thermally conductive insulating material.
brSubstrate: It is a metal substrate, usually aluminum or optional copper. Aluminum-based copper-clad laminates and traditional epoxy glass cloth laminates, etc.
The thermally conductive insulating layer of high-performance aluminum-based circuit boards uses this technology, giving it extremely excellent thermal conductivity and high-strength electrical insulation properties. The metal base layer is the supporting component of the aluminum substrate and requires high thermal conductivity. It is generally an aluminum plate, but a copper plate can also be used (copper plate can provide better thermal conductivity), and is suitable for conventional mechanical processing such as drilling, punching, and cutting. B material has incomparable advantages compared with other materials. Suitable for surface mounting of power components. No radiator is needed, the volume is greatly reduced, the heat dissipation effect is excellent, and the insulation and mechanical properties are good.
The circuit layer (i.e. copper foil) is usually etched to form a printed circuit to connect the various parts of the component to each other. Generally, the circuit layer requires a large current carrying capacity, so thicker copper foil should be used. The thickness is generally 3 ~ Thermal conductive insulation layer is the core technology of aluminum-based circuit boards. It is generally composed of special polymers filled with special ceramics. It has small thermal resistance, excellent viscoelastic properties, has the ability to resist thermal aging, and can withstand mechanical and thermal stress.
Zhongtian Yuan Circuit Board Company is a high-tech enterprise in Zhengzhou specializing in the R&D, production and processing of B circuit boards, multi-layer printed boards and aluminum substrates. We have always put quality first and customer first as our service Our aim is to provide you with considerate service. We welcome customers and friends to call us for consultation and purchase!
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