Professional copy board company proofing circuit board circuit board

process design specifications
Zhongtian Yuan Circuit Board Co., Ltd. is a high-tech enterprise in Zhengzhou specializing in the R&D, production and processing of B circuit boards, multi-layer printed boards, and aluminum substrates.
. Purpose
Standardize the process design of the product and stipulate the relevant parameters of the process design so that the design meets the technical specification requirements of producibility, testability, safety regulations, etc. During the product design process Build product process, technology, quality and cost advantages.
. Scope of application
This specification applies to the process design of all electrical products, and is used in but not limited to design, board process review, single board process review and other activities. If the contents of relevant standards and specifications before this specification conflict with the provisions of this specification, this specification shall prevail.
3. Definition
Via: A metallized hole used for inner layer connection, but not used for inserting component leads or other reinforcing materials.
Blind hole (B): A via hole that extends from the printed board to only one surface layer.
Buried via (Br): A via hole that does not extend to the surface of the printed board.
Via: A conductive hole extending from one surface layer of a printed circuit board to another surface layer.
Component hole ( ): A hole used for fixing component terminals to the printed board and electrically connecting conductive patterns.
The vertical distance from the bottom of the body of the surface mount device to the bottom of the pin.
. Citation/Reference Standards or Materials
Information Technology Equipmentb
Design Specification for Thermal Design of Forced Air Cooling of Electronic Equipment
Specification for Thermal Design of Natural Cooling of Electronic Equipment
Print Board design, manufacturing and assembly terms and definitions (
)
Acceptance conditions for printed boards (b)
. Specification content
. Board material requirements
.. Determination of use Board material and value
Determine the board material selected, such as R, aluminum substrate, ceramic substrate, paper core board, etc. If a high-value board is selected, the thickness tolerance should be noted in the document.
.. Determined surface treatment coating
Determine the surface treatment coating of the copper foil, such as tin plating, nickel gold plating or etc., and indicate it in the document.
3