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PCB proofing丨Zhongtianyuan PCB small batch丨PCB circuit board

total supply
100000 pcs
MOQ
1 pcs
brand
中一天元
area
HenanZhengzhou City
Delivery period:
Shipped within 3 days from the date of payment by the buyer
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Shop information

area:Henan Zhengzhou City

Member level:corporate memberYear1

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Already paid:0.00 yuan deposit

my badge: [Integrity File]

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Henan Zhongdianyuan Electronic Equipment Co

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Product Details
Henan Zhongtian Yuan Electronic Equipment Co., Ltd. provides global customers with one-stop electronic manufacturing services from B to B of printed circuit boards. Especially for samples and small batch orders, it has the characteristics of fast quotation, rapid production and global express delivery. Our company has its own circuit board factory and production line, as well as a professional customer service team, component procurement team and assembly testing team to ensure the quality and fast delivery of each product.
Our products and services include: circuit board wiring, layer circuit board manufacturing, electronic component procurement, flexible circuit boards, membrane switch products, conductive silicone rubber products, metal casings, solder paste stencils, and electronic wiring harnesses wait.
These products are widely used in telecommunications, industrial control, power systems, digital products, lighting equipment, transportation systems, home appliances, medical systems and the automotive industry.
Our circuit board production process capabilities are as follows:
Surface technology: spray tin, lead-free spray tin, electroplated nickel gold, chemical nickel gold, etc., film, etc.
, Number of B layers and r layers
, Maximum processing area of single-sided double-sided panels
, Board thickness.. Minimum line width. Minimum line spacing.
, Minimum finished product aperture.
/> , minimum pad diameter.
, metallized hole aperture tolerance Ф..>Ф..
, hole position difference.
, insulation resistance> (normal)
, Hole resistance
, Electrical strength
, Peel strength
, Solder resist hardness>
, Thermal shock ℃
, Combustion level
, Can Solderability ℃, internal wet warpage <. Ion cleanliness <. microgram
, base copper foil thickness:,,
, coating thickness: generally micron, can also reach micron
, Commonly used base materials: R,,,,, B aluminum substrate
, Customer supply information method: R file, B file, R file, file, file, file, b file, template, etc.
Disclaimer

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