DowCorning American Dow Corning 184 potting compound

American Dow Corning Potting Adhesive
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. ) ' .Product Features<
' . Pretreatment The surface to be potted needs to be cleaned or degreased. In order to achieve the best potting effect, It is recommended to use
primer
'. Sizing using manual or automatic equipment

mix the components evenly according to the ratio (
weight)
. In situations that are sensitive to gas mixing, it is necessary to perform degassing treatment for

'. Curing: This product will cure at room temperature. Heating can accelerate the curing. It will cure in hours at room temperature
'
' .Applicable fields<
' .Low-stress protection solidified into elastomer to protect components from damage in harsh environments such as mechanical vibration and hot and cold cycles<
' .No corrosion Addition reaction system, no by-products are produced during the reaction process, the volume does not change, and it is more environmentally friendly
'. Transparent and optically transparent. Can be used in situations that require transparency or lower optical requirements<
' . Easy to demould The surface is smooth, the surface energy is low, and it is easy to demould<
'
' . Instructions for use<
'. Suitable for electronic equipment requiring low stress. Such as sensor modules, petri dishes, and experimental molds.