Dow Corning TC-5022 thermal paste for CPU is green, environmentally friendly and pollution-free

Dow Corning Thermal Paste
The thermal paste used by Dow Corning is green, environmentally friendly and pollution-free
Dow Corning recently announced the launch of a new thermal grease that can provide high thermal conductivity and low ownership cost for high-end microprocessor packages. Its thermal conductivity efficiency ratio Thermal grease currently on the market is on average high in price and is suitable for various heat sinks, including lower-cost heat sinks, thereby reducing the user's total manufacturing cost.
The use of thermally conductive silicone grease can make the interface thickness ( ) below microns, allowing manufacturers to obtain extremely low thermal resistance.
This new material has excellent long-term thermal stability, and the processing process is not affected by pressure, providing users with a wide range of process applications ( ) to improve manufacturing stability, reusability and overall quality. Rate. The company stated that because the package heat dissipation management of the new generation of flip-chip microprocessors is more difficult, thermal grease and other thermal interface materials have become important considerations in its R&D and design process.
In addition to thermal grease, we also provide a wide range of thermal interface materials, including thermal pads, thermal films and gels, to meet various thermal management requirements in the industry.