Product Description and Features
This glue is a two-component silicone additive system thermally conductive potting glue. It does not shrink during the curing process and has excellent insulation properties.
The rubber will be stored for a long time after being mixed at room temperature, but it can be quickly cured under heating conditions, which is especially beneficial for use on automatic production lines.
It has good temperature resistance and aging resistance. After curing, it maintains rubber elasticity in a wide temperature range ~℃.
Has good flame retardancy and thermal conductivity.
Two basic uses
It is widely used for potting protection of high-power electronic components, module power supplies and circuit boards with high requirements for heat dissipation and temperature resistance. Such as automotive light module power supply, automotive ignition system control module, etc.
Three technical parameters
Appearance
Gray fluid
After curing
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Component viscosity, ℃
~
Hardness Shore
~
Component Viscosity,℃
~
Volume resistivity
Operating performance
< br/> Mixing ratio weight ratio B
Dielectric strength/
Viscosity after mixing, ℃
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Dielectric constant
~
Mixed density/,℃
< br/> Linear expansion coefficient[/]
Operating time, ℃
~
Thermal conductivity coefficient[ /]
Curing time, ℃
Flame retardant grade
Curing Time,℃