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Epoxy resin high-temperature adhesive|high-strength structural adh

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Thomas PCB circuit board reflow soldering high temperature resistant glue THO4059-1

价格 10.00元/公斤
total supply
1000 公斤
MOQ
1 公斤
brand
托马斯/THOMAS
area
SichuanChengdu City
Delivery period:
Shipped within 3 days from the date of payment by the buyer
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area:Sichuan Chengdu City

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Chengdu Thomas Technology Co

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Product Details
规格:
公斤
包装:
罐装
< Name

Thomas B special high temperature resistant adhesive for circuit board transplantation


< Overview

This series of special epoxy resin double modified It is a one-component adhesive that cures quickly when heated, has high bonding strength, excellent temperature resistance, and is easy to operate.



Suitable for self-adhesion and mutual adhesion of cermet composite materials (B, etc.) working under high temperature conditions. It is also suitable for repair and Bonding and sealing of heating components of electrical instruments and high-temperature reflow soldering.



Performance

Features
Points

Appearance: multi-color Thick liquid, no solid particles.
The curing speed is fast, and it will initially solidify in hours at ℃, and will approach the maximum bonding strength after complete cooling.
High bonding strength, excellent soldering resistance, good toughness and resistance to hot and cold shock cycles.
It has good temperature resistance and can adapt to a wide temperature range. It still has good bonding effect at higher temperatures after bonding.
The bonding surface does not require strict treatment and is easy to use.
Excellent media resistance, resistant to oil, water, acid, kerosene, alkali, etc.
Safety and toxicity characteristics: It has a very slight odor, no inhalation hazard, and is actually non-toxic after curing.
The storage stability is good, and the storage period is half a year at ℃.
The product complies with European and American R directive standards.
The main technical performance indicators are as follows: Temperature resistance range: +°C Bonding strength: Normal temperature: Tensile strength Shear strength°C: Tensile strength Bending times without cracks


< Use
Method

Wipe the adherend with stain removal wiper.
The glue is thixotropic and can be directly applied to the diameter round hole. It will not flow during the heating and curing process, reducing the process of cleaning the circuit board.
Apply the glue to the interface of the adherends, close them tightly and let them stand and heat for an hour. (℃)


< Note
Matters

Pay attention to ventilation in the operating environment.
If the glue touches the skin, rinse it with soapy water immediately.
Unused glue should be covered and stored in a cool place.


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